Patent Assignment
Reel/Frame 028021/0867
Assignment of Assignor's Interest
Recorded: 2012-04-10
Pages: 4
Assignors
CHEN, YU-FENG
Executed: 2012-03-27
LIN, CHUN-HUNG
Executed: 2012-03-27
PU, HAN-PING
Executed: 2012-03-27
TUNG, CHIH-HANG
Executed: 2012-03-29
WU, KAI-CHIANG
Executed: 2012-03-27
HO, MING-CHE
Executed: 2012-03-27
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
NO. 8, LI-HSIN RD. VI, HSINCHU SCIENCE PARK, HSINCHU, 300, TAIWAN
Covered Property
(1)
Crack Stopper on Under-Bump Metallization Layer