Patent Assignment
Reel/Frame 028025/0845
Assignment of Assignor's Interest
Recorded: 2012-04-11
Pages: 3
Assignor
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
Executed: 2012-03-01
Assignee
TSMC SOLID STATE LIGHTING LTD.
9, LI-HSIN 4TH ROAD, HSINCHU SCIENCE PARK, HSINCHU, 300-77, TAIWAN
Covered Property
(1)
Light Emitting Diode with a Micro-Structure Lens Having a Ridged Surface
Related Assignments
(4)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest
Apr 15, 2011
From: LEE, HSIAO-WEN; TSAI, SHANG-YU; KO, PEI-WEN
To: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
Reel/Frame 026134/0746 →
Change of Name
Dec 3, 2015
From: TSMC SOLID STATE LIGHTING LTD.
To: CHIP STAR LTD.
Reel/Frame 037208/0429 →
Merger
Dec 3, 2015
From: CHIP STAR LTD.
To: EPISTAR CORPORATION
Reel/Frame 037457/0521 →
Change of Name
Apr 22, 2026
From: EPISTAR CORPORATION
To: ENNOSTAR CORPORATION
Reel/Frame 075513/0783 →