Patent Assignment
Reel/Frame 028032/0114
Assignment of Assignor's Interest
Recorded: 2012-04-12
Pages: 3
Assignor
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD.
Executed: 2012-03-01
Assignee
TSMC SOLID STATE LIGHTING LTD
9, LI-HSIN 4TH ROAD, HSINCHU SCIENCE PARK, HSINCHU, 300-77, TAIWAN
Covered Property
(1)
Qfn/Son Compatible Package with Smt Land Pads
Related Assignments
(7)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest
Oct 24, 2005
From: HOLLAND, GRAEME
To: PAPER TO PAPER AUSTRALIA PTY LTD.
Reel/Frame 017132/0902 →
Assignment of Assignor's Interest
Oct 16, 2006
From: HASE, ANDREAS ALFRED
To: HYMITE GMBH
Reel/Frame 018395/0972 →
Assignment of Assignor's Interest
Nov 22, 2006
From: HYMITE GMBH
To: HYMITE A/S
Reel/Frame 018547/0598 →
Assignment of Assignor's Interest
Nov 30, 2010
From: HYMITE A/S
To: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
Reel/Frame 025403/0566 →
Merger
Feb 23, 2016
From: CHIP STAR LTD.
To: EPISTAR CORPORATION
Reel/Frame 037805/0584 →
Change of Name
Feb 23, 2016
From: TSMC SOLID STATE LIGHTING LTD.
To: CHIP STAR LTD.
Reel/Frame 037809/0968 →
Change of Name
Apr 22, 2026
From: EPISTAR CORPORATION
To: ENNOSTAR CORPORATION
Reel/Frame 075513/0783 →