IP Library › Assignment 028040/0657
Patent Assignment
Reel/Frame 028040/0657

Change of Name

Recorded: 2012-04-13 Pages: 2
Assignor
Assignee
GLOBALFOUNDRIES SINGAPORE PTE. LTD.
60 WOODLANDS INDUSTRIAL PARK D STREET 2, SINGAPORE, 738406, SINGAPORE
Covered Property (1)
Method of Forming Shallow Trench Isolation Structures for Integrated Circuits
Patent: 8,178,417 →
Application: 12/107,751 →
Publication: US 2009/0261448
Related Assignments (4)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest Apr 22, 2008
From: MISHRA, SHAILENDRA; LEE, JAMES YONG MENG; LUN, ZHAO; GAO, WEN ZHI
To: CHARTERED SEMICONDUCTOR MANUFACTURING, LTD.
Reel/Frame 020841/0315 →
Change of Name Apr 13, 2012
From: CHARTERED SEMICONDUCTOR MANUFACTURING LTD.
To: CHARTERED SEMICONDUCTOR MANUFACTURING PTE. LTD.
Reel/Frame 028040/0612 →
Assignment of Assignor's Interest Jul 2, 2019
From: GLOBALFOUNDRIES SINGAPORE PTE. LTD.
To: ALSEPHINA INNOVATIONS INC.
Reel/Frame 049669/0775 →
Release of Security Interest Nov 19, 2020
From: WILMINGTON TRUST, NATIONAL ASSOCIATION
To: GLOBALFOUNDRIES SINGAPORE PTE. LTD.
Reel/Frame 054481/0673 →