Patent Assignment
Reel/Frame 028127/0804
Assignment of Assignor's Interest
Recorded: 2012-04-30
Pages: 10
Assignors
NICHOLLS, LOUIS W.
Executed: 2012-04-18
ST. AMAND, ROGER D.
Executed: 2012-04-18
KIM, JIN SEONG
Executed: 2012-04-19
JUNG, WOON KAB
Executed: 2012-04-19
YANG, SUNG JIN
Executed: 2012-04-17
DARVEAUX, ROBERT F.
Executed: 2012-04-18
Assignee
AMKOR TECHNOLOGY, INC.
1900 SOUTH PRICE ROAD, CHANDLER, ARIZONA, 85286-6604
Covered Property
(1)
Methods and Structures for Increasing the Allowable Die Size in Tmv Packages
Patent:
9,721,872 →
Application:
13/398,646 →
Related Assignments
(3)
Other recorded transfers of the patent in this record — the chain of ownership.
Patent Security Agreement
May 7, 2015
From: AMKOR TECHNOLOGY, INC.
To: BANK OF AMERICA, N.A.
Reel/Frame 035613/0592 →
Security Interest
Aug 1, 2018
From: AMKOR TECHNOLOGY, INC.
To: BANK OF AMERICA, N.A., AS AGENT
Reel/Frame 046683/0139 →
Assignment of Assignor's Interest
Oct 12, 2020
From: AMKOR TECHNOLOGY, INC.
To: AMKOR TECHNOLOGY SINGAPORE HOLDING PTE.LTD.
Reel/Frame 054046/0673 →