Patent Assignment
Reel/Frame 028139/0690
Assignment of Assignor's Interest
Recorded: 2012-05-02
Pages: 2
Assignors
JANGJIAN, SHIU-KO
Executed: 2012-02-14
WU, SZU-AN
Executed: 2012-02-14
CHEN, SHENG-WEN
Executed: 2012-02-14
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
NO. 8, LI-HSIN RD. 6, SCIENCE-BASED INDUSTRIAL PARK, HSIN-CHU, 300-77 R.O.C., TAIWAN
Covered Property
(1)
Grids in Backside Illumination Image Sensor Chips and Methods for Forming the Same