Patent Assignment
Reel/Frame 028140/0875
Assignment of Assignor's Interest
Recorded: 2012-05-02
Pages: 2
Assignor
ISHIKIDA, MASAYUKI
Executed: 2012-04-27
Assignee
SONY CORPORATION
1-7-1 KONAN, MINATO-KU, TOKYO, JAPAN
Covered Property
(1)
Semiconductor Package, Semiconductor Device Manufacturing Method, and Solid-State Imaging Device