IP Library Assignment 028186/0517
Patent Assignment
Reel/Frame 028186/0517

Assignment of Assignor's Interest

Recorded: 2012-05-09 Pages: 4
Assignors
HARADA, KOICHIRO
Executed: 2012-04-13
MICHITA, NORIAKI
Executed: 2012-04-13
UEDA, TATSUSHI
Executed: 2012-04-13
SATO, TAKAYUKI
Executed: 2012-04-13
Assignee
HITACHI KOKUSAI ELECTRIC, INC.
14-1, SOTOKANDA 4-CHOME,, CHIYODA-KU, TOKYO 101-8980, JAPAN
Covered Property (1)
Substrate Processing Apparatus, Method for Manufacturing Semiconductor Device, Method for Processing Substrates
Patent: 9,748,132 →
Application: 13/427,281 →
Publication: US 2012/0252220
Related Assignments (1)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest Dec 31, 2018
From: HITACHI KOKUSAI ELECTRIC INC.
To: KOKUSAI ELECTRIC CORPORATION
Reel/Frame 048008/0206 →