Substrate processing apparatus, method for manufacturing semiconductor device, method for processing substrates

1. A substrate processing apparatus comprising:

a processing chamber configured to process a substrate;

a substrate supporting member provided in the processing chamber, the substrate supporting member being configured to support the substrate;

a gas supply section configured to supply processing gas into the processing chamber;

a gas exhaust section configured to exhaust an inside of the processing chamber;

a plasma generating section configured to excite the processing gas supplied into the processing chamber;

a controller configured to control the gas supply section, the gas exhaust section, and the plasma generating section;

and a substrate upthrust pin that temporarily holds the substrate, wherein

the substrate supporting member includes a susceptor, and a susceptor cover covering the susceptor,

the susceptor has a heating section inside, the heating section being configured to heat the substrate,

the susceptor cover has a thickness range from 0.7 mm to 1.5 mm,

the susceptor cover is provided separately from the susceptor, the susceptor cover being attachable and detachable to/from the susceptor,

the susceptor cover has an upper surface that includes:

a protruding area that continuously supports an outer peripheral edge of the substrate so as to surround the substrate from below;

a recessed area that is provided inside of the protruding area so as not to be brought into contact with the substrate supported by the protruding area;

and a plurality of auxiliary protruding areas that are formed below the protruding area, the plurality of auxiliary protruding areas being provided in the recessed area on a first circle concentric with the outer peripheral edge of the substrate supporting member;

and a plurality of through-holes, each of the plurality of through-holes being configured to communicate into the recessed area, and to allow a gas between the substrate and the substrate supporting member to escape from the recessed area side, the plurality of through-holes being provided at different positions than the plurality of auxiliary protruding areas, and on a second circle concentric with the outer peripheral edge of the substrate supporting member,

the plurality of through holes are provided in the susceptor and susceptor cover, and the substrate upthrust pin is configured to (i) be inserted into a corresponding one of the plurality of through-holes, and (ii) temporarily hold the substrate above the substrate supporting member via the corresponding one of the plurality of through-holes;

wherein the susceptor has an impedance adjusting electrode inside.

2. The substrate processing apparatus according to claim 1 , wherein a diameter of a surface of each of the plurality of auxiliary protruding areas is smaller than 2.8 mm.

3. The substrate processing apparatus according to claim 1 , wherein the plurality of auxiliary protruding areas includes three or more auxiliary protruding areas.

4. The substrate processing apparatus according to claim 1 , further comprising a substrate elevation mechanism configured to elevate the substrate by the substrate upthrust pin,

wherein the controller is configured to control the substrate elevation mechanism, the gas supply section and the gas exhaust section to set a pressure inside of the processing chamber to higher than 100 Pa when the substrate upthrust pin temporarily holds the substrate above the substrate supporting member, and thereafter place the substrate on the protruding area from the substrate upthrust pin.

5. The substrate processing apparatus according to claim 1 , wherein each of the auxiliary protruding areas is in a cylindrical shape.

6. The substrate processing apparatus according to claim 1 , wherein each of the protruding area and the plurality of auxiliary protruding areas has a supporting surface supporting the substrate, the supporting surface being a mirror surface.

7. The substrate processing apparatus according to claim 1 , wherein the plurality of auxiliary protruding areas are provided in a portion of the recessed area excluding a center of the recessed area.

8. The substrate processing apparatus according to claim 1 , further comprising a substrate elevation mechanism configured to elevate the substrate by the substrate upthrust pin,

wherein the controller is configured to control the substrate elevation mechanism and the heating section to (i) preheat the substrate with the heating section for a predetermined time when the substrate upthrust pin temporarily holds the substrate above the substrate supporting member, and (ii) heat the substrate by the heating section by placing the substrate on the protruding area after the predetermined time.

9. The substrate processing apparatus according to claim 1 , wherein the plurality of through holes are opened at a bottom of the recessed area.

10. The substrate processing apparatus according to claim 9 , wherein the plurality of auxiliary protruding areas auxiliarily support the substrate so that the substrate does not block the plurality of through holes.

11. The substrate processing apparatus according to claim 1 , wherein the plurality of auxiliary protruding areas are not provided in a region excluding the first concentric circle, and

the plurality of through holes are disposed radially outside an outermost periphery of the first concentric circle.

12. The substrate processing apparatus according to claim 1 , further comprising a lamp heating unit configured to heat the substrate, the lamp heating unit being provided outside of the processing chamber.

13. The substrate processing apparatus according to claim 1 , further comprising an impedance variable mechanism.

14. The substrate processing apparatus according to claim 1 , wherein the substrate supporting member is configured to support the substrate without electrostatic chucking.