Patent Assignment
Reel/Frame 028238/0386
Assignment of Assignor's Interest
Recorded: 2012-05-21
Pages: 4
Assignors
HUKUSHIMA, IORI
Executed: 2012-03-30
HIRATA, TOMOHIRO
Executed: 2012-03-30
KONDOU, HIDEKAZU
Executed: 2012-04-03
KANEKO, SUSUMU
Executed: 2012-03-30
UEHARA, SATOSHI
Executed: 2012-03-30
MIYAMOTO, YUKI
Executed: 2012-04-02
Assignee
HITACHI CHEMICAL COMPANY, LTD.
1-1, NISHI-SHINJUKU 2-CHOME, SHINJUKU-KU, TOKYO, 163-0449, JAPAN
Covered Property
(1)
Thermosetting Resin Composition, Method for Forming Protective Film for Flexible Wiring Board, and Flexible Wiring Board
Related Assignments
(4)
Other recorded transfers of the patent in this record — the chain of ownership.
Change of Address
Jul 24, 2017
From: HITACHI CHEMICAL COMPANY, LTD.
To: HITACHI CHEMICAL COMPANY, LTD.
Reel/Frame 043313/0542 →
Change of Name
Mar 2, 2023
From: HITACHI CHEMICAL COMPANY, LTD.
To: SHOWA DENKO MATERIALS CO., LTD.
Reel/Frame 062917/0865 →
Change of Name
Mar 3, 2023
From: SHOWA DENKO MATERIALS CO., LTD.
To: RESONAC CORPORATION
Reel/Frame 062946/0125 →
Change of Address
Feb 14, 2024
From: RESONAC CORPORATION
To: RESONAC CORPORATION
Reel/Frame 066599/0037 →