Patent Assignment
Reel/Frame 043313/0542
Change of Address
Recorded: 2017-07-24
Pages: 2
Assignor
HITACHI CHEMICAL COMPANY, LTD.
Executed: 2013-01-01
Assignee
HITACHI CHEMICAL COMPANY, LTD.
9-2, MARUNOUCHI 1-CHOME, CHIYODA-KU, TOKYO, 1006606, JAPAN
Covered Property
(1)
Thermosetting Resin Composition, Method for Forming Protective Film for Flexible Wiring Board, and Flexible Wiring Board
Related Assignments
(4)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest
May 21, 2012
From: HUKUSHIMA, IORI; HIRATA, TOMOHIRO; KONDOU, HIDEKAZU; KANEKO, SUSUMU
To: HITACHI CHEMICAL COMPANY, LTD.
Reel/Frame 028238/0386 →
Change of Name
Mar 2, 2023
From: HITACHI CHEMICAL COMPANY, LTD.
To: SHOWA DENKO MATERIALS CO., LTD.
Reel/Frame 062917/0865 →
Change of Name
Mar 3, 2023
From: SHOWA DENKO MATERIALS CO., LTD.
To: RESONAC CORPORATION
Reel/Frame 062946/0125 →
Change of Address
Feb 14, 2024
From: RESONAC CORPORATION
To: RESONAC CORPORATION
Reel/Frame 066599/0037 →