Assignment of Assignor's Interest

Recorded: 2012-06-13 Pages: 9

Assignors

CHANCHANI, RAJEN

Executed: 2012-01-26

NORDQUIST, CHRISTOPHER

Executed: 2012-01-25

OLSSON, ROY H.

Executed: 2012-01-25

PETERSON, TRACY C.

Executed: 2012-01-25

SCHUL, RANDY J.

Executed: 2012-01-25

AHLERS, CATALINA

Executed: 2012-01-25

PLUT, THOMAS A.

Executed: 2012-01-25

PATRIZI, GARY A.

Executed: 2012-02-01

Assignee

SANDIA CORPORATION

P.O. BOX 5800, MS0161, ALBUQUERQUE, NEW MEXICO, 87185-0161

Covered Property (1)

MEMS Packaging with Etching and Thinning of Lid Wafer to Form Lids and Expose Device Wafer Bond Pads

Patent: 8,597,985 →

Application: 13/364,166 →

Related Assignments (2)

Other recorded transfers of the patent in this record — the chain of ownership.