Patent Assignment
Reel/Frame 031746/0231
Confirmatory License
Recorded: 2013-12-02
Pages: 2
Assignor
SANDIA CORPORATION
Executed: 2013-11-04
Assignee
U.S. DEPARTMENT OF ENERGY
1000 INDEPENDNCE AVE., SW, WASHINGTON, DISTRICT OF COLUMBIA, 20585
Covered Property
(1)
MEMS Packaging with Etching and Thinning of Lid Wafer to Form Lids and Expose Device Wafer Bond Pads
Patent:
8,597,985 →
Application:
13/364,166 →
Related Assignments
(2)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest
Jun 13, 2012
From: CHANCHANI, RAJEN; NORDQUIST, CHRISTOPHER; OLSSON, ROY H.; PETERSON, TRACY C.
To: SANDIA CORPORATION
Reel/Frame 028366/0422 →
Change of Name
May 22, 2018
From: SANDIA CORPORATION
To: NATIONAL TECHNOLOGY & ENGINEERING SOLUTIONS OF SANDIA, LLC
Reel/Frame 046207/0012 →