Patent Assignment
Reel/Frame 028370/0457
Assignment of Assignor's Interest
Recorded: 2012-06-13
Pages: 3
Assignors
JEON, CHANG-SEONG
Executed: 2012-05-22
PARK, SANGWOOK
Executed: 2012-05-22
LEE, TEAKHOON
Executed: 2012-05-22
HAN, ILYOUNG
Executed: 2012-05-22
Assignee
SAMSUNG ELECTRONICS CO., LTD.
416, MAETAN-DONG, YEONGTONG-GU, SUWON-SI, GYEONGGI-DO, KOREA, REPUBLIC OF
Covered Property
(1)
Apparatus of Manufacturing Semiconductor Packages and Methods of Manufacturing Semiconductor Packages Using the Same