Patent Assignment
Reel/Frame 028376/0504
Assignment of Assignor's Interest
Recorded: 2012-06-14
Pages: 3
Assignor
DELEON, JERRY
Executed: 2012-05-08
Assignee
EXCELITAS TECHNOLOGIES PHILIPPINES, INC.
#3 AMPERE STREET, LIGHT INDUSTRY & SCIENCE PARK 1, BARANGAY DIEZMO, CABUYAO, LAGUNA, 4025, PHILIPPINES
Covered Property
(1)
Semiconductor Laser Chip Package with Encapsulated Recess Molded on Substrate and Method for Forming Same
Related Assignments
(3)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest
Jun 14, 2012
From: JU, JIN HAN; BURMAN, ROBERT
To: EXCELITAS CANADA INC.
Reel/Frame 028376/0589 →
Assignment of Assignor's Interest
Jun 14, 2012
From: EXCELITAS TECHNOLOGIES PHILIPPINES, INC.
To: EXCELITAS CANADA INC.
Reel/Frame 028376/0763 →
Security Interest
Aug 12, 2022
From: EXCELITAS CANADA INC.
To: GOLUB CAPITAL MARKETS LLC, AS COLLATERAL AGENT
Reel/Frame 061161/0079 →