Patent Assignment
Reel/Frame 028376/0763
Assignment of Assignor's Interest
Recorded: 2012-06-14
Pages: 3
Assignor
EXCELITAS TECHNOLOGIES PHILIPPINES, INC.
Executed: 2012-06-14
Assignee
EXCELITAS CANADA INC.
22001 DUMBERRY, VAUDREUIL, QUEBEC, J7V8P7, CANADA
Covered Property
(1)
Semiconductor Laser Chip Package with Encapsulated Recess Molded on Substrate and Method for Forming Same
Related Assignments
(3)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest
Jun 14, 2012
From: DELEON, JERRY
To: EXCELITAS TECHNOLOGIES PHILIPPINES, INC.
Reel/Frame 028376/0504 →
Assignment of Assignor's Interest
Jun 14, 2012
From: JU, JIN HAN; BURMAN, ROBERT
To: EXCELITAS CANADA INC.
Reel/Frame 028376/0589 →
Security Interest
Aug 12, 2022
From: EXCELITAS CANADA INC.
To: GOLUB CAPITAL MARKETS LLC, AS COLLATERAL AGENT
Reel/Frame 061161/0079 →