Patent Assignment
Reel/Frame 028437/0581
Assignment of Assignor's Interest
Recorded: 2012-06-25
Pages: 4
Assignors
HUANG, CHANG-CHIA
Executed: 2012-04-18
LIN, TSUNG-SHU
Executed: 2012-04-18
PU, HAN-PING
Executed: 2012-04-19
LIN, YEN-LIANG
Executed: 2012-04-23
CHIU, SHENG-HSIANG
Executed: 2012-04-23
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
NO. 8, LI-HSIN RD. 6, SCIENCE-BASED INDUSTRIAL PARK, HSIN-CHU, 300-77 R.O.C., TAIWAN
Covered Property
(1)
Methods and Apparatus for bump-on-trace Chip Packaging
Application:
13/450,191 →
Publication:
US 2013/0277828