Patent Assignment
Reel/Frame 028438/0463
Assignment of Assignor's Interest
Recorded: 2012-06-25
Pages: 4
Assignors
HSU, CHUN-LEI
Executed: 2012-06-13
LIU, CHUNG-SHI
Executed: 2012-06-13
LU, DE-YUAN
Executed: 2012-06-13
HO, MING-CHE
Executed: 2012-06-13
CHEN, YU-FENG
Executed: 2012-06-13
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY
NO. 8, LI-HSIN RD. 6, SCIENCE-BASED INDUSTRIAL PARK, HSIN-CHU, 300-77, TAIWAN
Covered Property
(1)
Package on Package Devices and Methods of Packaging Semiconductor Dies