IP Library › Assignment 028494/0485
Patent Assignment
Reel/Frame 028494/0485

Assignment of Assignor's Interest

Recorded: 2012-07-05 Pages: 4
Assignors
LEONG, LUP SAN
Executed: 2012-07-04
ZOU, ZHENG
Executed: 2012-07-04
SEE, ALEX KAI HUNG
Executed: 2012-07-05
CONG, HAI
Executed: 2012-07-04
RAO, XUESONG
Executed: 2012-07-04
TAN, YUN LING
Executed: 2012-07-04
LIU, HUANG
Executed: 2012-07-04
Assignee
GLOBALFOUNDRIES SINGAPORE PTE. LTD.
60 WOODLANDS INDUSTRIAL PARK D, STREET 2, SINGAPORE, 738406, SINGAPORE
Covered Property (1)
Method for Forming Through Silicon via with Wafer Backside Protection
Patent: 8,940,637 →
Application: 13/542,256 →
Publication: US 2014/0008810
Related Assignments (2)
Other recorded transfers of the patent in this record — the chain of ownership.
Security Agreement Nov 27, 2018
From: GLOBALFOUNDRIES SINGAPORE PTE. LTD.
To: WILMINGTON TRUST, NATIONAL ASSOCIATION
Reel/Frame 047660/0203 →
Release of Security Interest Nov 19, 2020
From: WILMINGTON TRUST, NATIONAL ASSOCIATION
To: GLOBALFOUNDRIES SINGAPORE PTE. LTD.
Reel/Frame 054481/0673 →