Patent Assignment
Reel/Frame 028509/0795
Change of Name
Recorded: 2012-07-07
Pages: 13
Assignor
FUJITSU MICROELECTRONICS LIMITED
Executed: 2010-04-01
Assignee
FUJITSU SEMICONDUCTOR LIMITED
2-10-23 SHIN-YOKOHAMA, KOHOKU-KU,YOKOHAMA-SHI, KANAGAWA, 222-0033, JAPAN
Covered Property
(1)
A Device for Bonding a Metal on a Surface of a Substrate
Related Assignments
(6)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest
Mar 22, 2005
From: SUGA, TADATOMO; ITO, TOSHIHIRO; YAMAUCHI, AKIRA
To: SUGA, TADATOMO; TORAY ENGINEERING CO., LTD.; OKI ELECTRIC INDUSTRY CO., LTD.; SANYO ELECTRIC CO., LTD.
Reel/Frame 016993/0702 →
Change of Name
Nov 14, 2008
From: MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD.
To: PANASONIC CORPORATION
Reel/Frame 021839/0934 →
Assignment of Assignor's Interest
Feb 13, 2009
From: FUJITSU LIMITED
To: FUJITSU MICROELECTRONICS LIMITED
Reel/Frame 022248/0521 →
Change of Name
Mar 21, 2014
From: OKI SEMICONDUCTOR CO., LTD
To: LAPIS SEMICONDUCTOR CO., LTD.
Reel/Frame 032495/0483 →
Merger and Change of Name
Sep 9, 2014
From: RENESAS TECHNOLOGY CORP.; NEC ELECTRONICS CORPORATION
To: RENESAS ELECTRONICS CORPORATION
Reel/Frame 033698/0648 →
Change of Address
Nov 29, 2017
From: RENESAS ELECTRONICS CORPORATION
To: RENESAS ELECTRONICS CORPORATION
Reel/Frame 044928/0001 →