Patent Assignment
Reel/Frame 033698/0648
Merger and Change of Name
Recorded: 2014-09-09
Received: 2014-09-09
Pages: 11
Assignors
NEC ELECTRONICS CORPORATION
Executed: 2010-04-10
RENESAS TECHNOLOGY CORP.
Executed: 2010-04-10
Assignee
RENESAS ELECTRONICS CORPORATION
1753, SHIMONUMABE, NAKAHARA-KU, KAWASAKI-SHI, KANAGAWA, JPX, JAPAN
Covered Properties
(35)
Semiconductor Device and Manufacturing Method of the Semiconductor Device
Application:
12/591,648 →
Semiconductor Integrated Circuit Package, Printed Circuit Board, Semiconductor Apparatus, and Power Supply Wiring Structure
Application:
12/204,677 →
Method of Determining Defects in Photomask
Application:
12/131,582 →
Signal Transmission Circuit and Signal Transmission System with Reduced Reflection
Application:
12/153,786 →
Packet Communication Device, Packet Communication System, Packet Communication Module, Data Processor, and Data Transfer System
Application:
12/010,762 →
Electrostatic Discharge Protection Circuit and Terminating Resistor Circuit
Application:
11/819,579 →
Method of Nickel Disilicide Formation and Method of Nickel Disilicate Source/Drain Formation
Application:
11/708,614 →
Narrow Impedance Conversion Device
Application:
11/500,943 →
Method of Manufacturing Wiring Substrate Having Terminated Buses
Application:
11/440,113 →
Semiconductor Memory Device
Application:
11/360,681 →
System and Method for Providing Head Amplitude Characterization
Application:
11/338,518 →
Semiconductor Device and Process for Producing the Same
Application:
11/296,289 →
Manufacturing Method of Semiconductor Device
Application:
11/182,055 →
A Device for Bonding a Metal on a Surface of a Substrate
Application:
10/528,690 →
Method to Enhance the Initiation of Film Growth
Application:
11/060,105 →
Signal Transmission System, and Signal Transmission Line
Application:
10/898,874 →
Memory Card
Application:
29/203,748 →
Signal Transmission Apparatus and Interconnection Structure
Application:
10/775,223 →
Semiconductor Device Manufacturing Method
Application:
10/748,286 →
Cleaning Gas and Etching Gas
Application:
10/480,285 →
Semiconductor Integrated Circuit Device Having Body Biasing Circuit for Generating Forward Well Bias Voltage of Suitable Level by Using Simple Circuitry
Application:
10/618,710 →
Semiconductor Characteristic Evaluation Apparatus
Application:
10/600,800 →
Circuit Structure and Semiconductor Integrated Circuit
Application:
10/348,896 →
Fet Having a Gate Electrode of a Honeycomb Structure
Application:
10/347,838 →
Electronic Device
Application:
10/331,767 →
Electronic Device
Application:
10/307,521 →
Wiring Substrate
Application:
10/228,305 →
Semiconductor Device
Application:
10/156,134 →
Method of Interbay Transportation
Application:
10/115,009 →
Method of Terminating Bus, Bus Termination Resistor, and Wiring Substrate Having Terminated Buses and Method of Its Manufacture
Application:
10/079,464 →
Execution Time Modification of Instruction Emulation Parameters
Application:
10/029,497 →
Semiconductor Circuit Device Having Power and Ground Lines Adapted for High-Frequency Operation
Application:
09/900,960 →
Carrier Shape Measurement Device
Application:
09/863,512 →
Phase-Shifting Photomask Blank, Phase-Shifting Photomask, Method for Producing Them and Apparatus for Manufacturing the Blank
Application:
09/805,902 →
Phase Shifter Film and Process for the Same
Application:
09/804,158 →