Patent Assignment
Reel/Frame 028580/0786
Assignment of Assignor's Interest
Recorded: 2012-07-18
Pages: 4
Assignors
YU, CHEN-HUA
Executed: 2012-07-13
CHEN, YUNG CHING
Executed: 2012-07-13
LEE, CHIEN-HSUN
Executed: 2012-07-13
WU, JIUN YI
Executed: 2012-07-13
LII, MIRNG-JI
Executed: 2012-07-13
CHENG, MING-DA
Executed: 2012-07-13
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
NO. 8, LI-HSIN RD. 6, SCIENCE-BASED INDUSTRIAL PARK, HSIN-CHU, 300-77 R.O.C., TAIWAN
Covered Property
(1)
Package on Package Devices and Methods of Packaging Semiconductor Dies