Package on package devices and methods of packaging semiconductor dies
Package on package (PoP) devices and methods of packaging semiconductor dies are disclosed. A PoP device includes a first packaged die and a second packaged die coupled to the first packaged die. Metal stud bumps are disposed between the first packaged die and the second packaged die. The metal stud bumps include a stick region, a first ball region coupled to a first end of the stick region, and a second ball region coupled to a second end of the stick region. The metal stud bumps include a portion that is partially embedded in a solder joint.
1. A method of packaging semiconductor dies, the method comprising:
coupling a first die to a first substrate;
coupling a plurality of metal stud bumps to the first substrate, each of the plurality of metal stud bumps including a stick region coupled to a surface of the first substrate and a ball region coupled to the stick region, the ball region and the stick region being a single continuous material, wherein the ball region has a larger width than the stick region;
coupling a second die to a second substrate;
forming a plurality of solder balls on the second substrate; and
coupling each of the plurality of metal stud bumps on the first substrate to one of the plurality of solder balls on the second substrate, the coupling comprising reflowing the plurality of solder balls, wherein a material of the solder balls extends to form solder joints extending from the second substrate to the first substrate.
2. The method according to claim 1 , wherein coupling the plurality of metal stud bumps to the first substrate comprises forming a plurality of metal stud bumps that are flexible.
3. The method according to claim 1 , wherein coupling the plurality of metal stud bumps to the first substrate comprises disposing a window clamp over the first substrate, the window clamp comprising a window, a first aperture, and a second aperture formed therein, wherein the first substrate is exposed through the window of the window clamp, and wherein the method further comprises forming the plurality of metal stud bumps using the first aperture and the second aperture of the window clamp.
4. The method according to claim 3 , further comprising placing the first substrate on a heat block.
5. The method according to claim 3 , wherein coupling each of the plurality of metal stud bumps to the first substrate comprises providing a wire, placing the wire in a capillary of a wire bonding machine, forming the ball region of each of the plurality of metal stud bumps at a first end of the wire using an electric flame off (EFO) electrical spark, placing the ball region in the first aperture of the window clamp, moving the wire to the second aperture of the window clamp, bending the wire to define a length of the stick region of each of the plurality of metal stud bumps, and ultrasonically vibrating a second end of the wire against a bond pad on the first substrate.
6. The method according to claim 5 , wherein forming the ball region of each of the plurality of metal stud bumps comprises forming a formed free air ball (FAB).
7. The method according to claim 5 , wherein forming the ball region of each of the plurality of metal stud bumps comprises forming a first ball region, wherein the wire comprises the stick region of each of the plurality of metal stud bumps, and wherein the method further comprises forming a second ball region of each of the plurality stud bumps at a second end of the wire, and wherein coupling each of the plurality of metal stud bumps to the first substrate comprises coupling the second ball region of each of the plurality of metal stud bumps to a bond pad on the first substrate.
8. A method of packaging semiconductor dies, the method comprising:
coupling a first die to a first substrate;
coupling a plurality of metal stud bumps to the first substrate, each of the plurality of metal stud bumps including a first ball region coupled to a surface of the first substrate, a stick region coupled to the first ball region at a first end of the stick region, and a second ball region coupled to a second end of the stick region;
coupling a second die to a second substrate;
forming a plurality of solder balls on the second substrate; and
coupling each of the plurality of metal stud bumps on the first substrate to one of the plurality of solder balls on the second substrate, wherein a material of the solder balls covers all sidewalls of the stick region such that the plurality of solder balls form a plurality of solder joints extending to the first substrate.
9. The method according to claim 8 , wherein coupling the plurality of metal stud bumps to the first substrate comprises forming a plurality of Cu stud bumps plated with Pd.
10. The method according to claim 8 , wherein the first substrate and the first die comprise a bottom packaged die, and wherein coupling the plurality of metal stud bumps to the first substrate comprises coupling the plurality of metal stud bumps to a top surface of the first substrate.
11. The method according to claim 8 , further comprising forming a solder paste on bond pads on a surface of the first substrate, before coupling the plurality of metal stud bumps to the first substrate, and wherein coupling the plurality of metal stud bumps to the first substrate comprises coupling the plurality of metal stud bumps to the solder paste on the bond pads on the surface of the first substrate.
12. The method according to claim 11 , further comprising heating the first substrate to reflow the solder paste.
13. The method according to claim 8 , wherein the first substrate and the first die comprise a top packaged die, and wherein coupling the plurality of metal stud bumps to the first substrate comprises coupling the plurality of metal stud bumps to a bottom surface of the first substrate.
14. The method according to claim 8 , further comprising heating the first substrate and the second substrate to reflow a solder material of the plurality of solder balls on the second substrate and form a plurality of solder joints between the first substrate and the second substrate, each of the plurality of solder joints including a portion of one of the plurality of metal stud bumps.
15. A method of packaging semiconductor dies, the method comprising:
coupling a first die to a first substrate;
disposing a window clamp over the first substrate, the window clamp comprising a window, a first aperture, and a second aperture formed therein, wherein the first substrate is exposed through the window of the window clamp,
forming a plurality of metal stud bumps using the first aperture and the second aperture of the window clamp;
coupling the plurality of metal stud bumps to the first substrate, each of the plurality of metal stud bumps including a stick region coupled to a surface of the first substrate and a ball region coupled to the stick region;
coupling a second die to a second substrate;
forming a plurality of solder balls on the second substrate; and
coupling each of the plurality of metal stud bumps on the first substrate to one of the plurality of solder balls on the second substrate.
16. The method according to claim 15 , further comprising placing the first substrate on a heat block.
17. The method according to claim 15 , wherein coupling each of the plurality of metal stud bumps to the first substrate comprises providing a wire, placing the wire in a capillary of a wire bonding machine, forming the ball region of each of the plurality of metal stud bumps at a first end of the wire using an electric flame off (EFO) electrical spark, placing the ball region in the first aperture of the window clamp, moving the wire to the second aperture of the window clamp, bending the wire to define a length of the stick region of each of the plurality of metal stud bumps, and ultrasonically vibrating a second end of the wire against a bond pad on the first substrate.
18. The method according to claim 17 , wherein forming the ball region of each of the plurality of metal stud bumps comprises forming a formed free air ball (FAB).
19. The method according to claim 17 , wherein forming the ball region of each of the plurality of metal stud bumps comprises forming a first ball region, wherein the wire comprises the stick region of each of the plurality of metal stud bumps, and wherein the method further comprises forming a second ball region of each of the plurality stud bumps at a second end of the wire, and wherein coupling each of the plurality of metal stud bumps to the first substrate comprises coupling the second ball region of each of the plurality of metal stud bumps to a bond pad on the first substrate.