Patent Assignment
Reel/Frame 028681/0602
Change of Name
Recorded: 2012-07-31
Pages: 2
Assignor
OSHIDA, DAISUKE
Executed: 2009-05-19
Assignee
NEC ELECTRONICS CORPORATION
1753 SHIMONUMABE, NAKAHARA-KU, KAWASAKI, KANAGAWA, 211-8668, JAPAN
Covered Property
(1)
Semiconductor Device Having Wiring Layer with a Wide Wiring and Fine Wirings
Related Assignments
(2)
Other recorded transfers of the patent in this record — the chain of ownership.