IP Library › Assignment 028681/0822
Patent Assignment
Reel/Frame 028681/0822

Change of Name

Recorded: 2012-07-31 Pages: 5
Assignor
NEC ELECTRONICS CORPORATION
Executed: 2010-04-01
Assignee
RENESAS ELECTRONICS CORPORATION
1753, SHIMONUMABE, NAKAHARA-KU, KAWASAKI-SHI, KANAGAWA, JAPAN
Covered Property (1)
Semiconductor Device Having Wiring Layer with a Wide Wiring and Fine Wirings
Patent: 8,426,975 →
Application: 13/561,752 →
Publication: US 2012/0292765
Related Assignments (2)
Other recorded transfers of the patent in this record — the chain of ownership.
Change of Name Jul 31, 2012
From: OSHIDA, DAISUKE
To: NEC ELECTRONICS CORPORATION
Reel/Frame 028681/0602 →
Change of Address Nov 29, 2017
From: RENESAS ELECTRONICS CORPORATION
To: RENESAS ELECTRONICS CORPORATION
Reel/Frame 044928/0001 →