IP Library › Assignment 028735/0527
Patent Assignment
Reel/Frame 028735/0527

Assignment of Assignor's Interest

Recorded: 2012-07-23 Pages: 3
Assignors
KURIMURA, HIROYUKI
Executed: 2012-06-27
MIYAZAKI, HAYATO
Executed: 2012-06-27
NAKAJIMA, GOSUKE
Executed: 2012-06-27
Assignee
DENKI KAGAKU KOGYO KABUSHIKI KAISHA
1-1, NIHONBASHI-MUROMACHI 2-CHOME, CHUO-KU, TOKYO 103-8338, JAPAN
Covered Property (1)
Method of Manufacturing Translucent Rigid Substrate Laminate and Translucent Rigid Substrate Bonding Apparatus
Patent: 9,242,442 →
Application: 13/574,510 →
Publication: US 2013/0037204
Related Assignments (1)
Other recorded transfers of the patent in this record — the chain of ownership.
Change of Name Nov 5, 2015
From: DENKI KAGAKU KOGYO KABUSHIKI KAISHA
To: DENKA COMPANY LIMITED
Reel/Frame 037054/0078 →