IP Library › Assignment 037054/0078
Patent Assignment
Reel/Frame 037054/0078

Change of Name

Recorded: 2015-11-05 Pages: 13
Assignor
Assignee
DENKA COMPANY LIMITED
1-1, NIHONBASHI-MUROMACHI 2-CHOME, CHUO-KU, TOKYO, 103-8338, JAPAN
Covered Properties (2)
Method of Manufacturing Translucent Rigid Substrate Laminate and Translucent Rigid Substrate Bonding Apparatus
Patent: 9,242,442 →
Application: 13/574,510 →
Publication: US 2013/0037204
Method for Processing Transluscent Rigid Substrate Laminate and Method for Manufacturing Plate Shaped Product
Patent: 9,227,385 →
Application: 13/885,929 →
Publication: US 2013/0233479
Related Assignments (2)
Other recorded transfers of the patents in this record — the chain of ownership.
Assignment of Assignor's Interest Jul 23, 2012
From: KURIMURA, HIROYUKI; MIYAZAKI, HAYATO; NAKAJIMA, GOSUKE
To: DENKI KAGAKU KOGYO KABUSHIKI KAISHA
Reel/Frame 028735/0527 →
Assignment of Assignor's Interest May 17, 2013
From: KURIMURA, HIROYUKI; MIYAZAKI, HAYATO
To: DENKI KAGAKU KOGYO KABUSHIKI KAISHA
Reel/Frame 030434/0504 →