Patent Assignment
Reel/Frame 028756/0004
Assignment of Assignor's Interest
Recorded: 2012-08-09
Pages: 3
Assignors
GURUMURTHY, CHARAN
Executed: 2008-09-28
GANESAN, SANKA
Executed: 2008-10-06
RAMASWAMY, CHANDRASHEKHAR
Executed: 2008-09-26
HLAD, MARK
Executed: 2008-09-29
Assignee
INTEL CORPORATION
2200 MISSION COLLEGE BOULEVARD, SANTA CLARA, CALIFORNIA, 95052
Covered Property
(1)
Method of Making Substrate Package with Through Holes for High Speed I/O Flex Cable
Related Assignments
(1)
Other recorded transfers of the patent in this record — the chain of ownership.