Method of making substrate package with through holes for high speed I/O flex cable
View Patent ↗An assembly of substrate packages interconnected with flex cables and a method of fabrication of the substrate package. The assembly allows input/output (I/O) signals to be speedily transmitted between substrate packages via flex cable and without being routed through the motherboard. Embodiments relate to a substrate package providing separable inter-package flex cable connection. Hermetically-sealed guiding through holes are provided on the substrate package as a mechanical alignment feature to guide connection between flex cables and high speed I/O contact pads on the substrate package. Embodiments of the method of fabrication relate to simultaneously forming hermetically-sealed guiding through holes and I/O contact pads.
1. A method of fabricating a substrate package, comprising:
forming a first plurality and a second plurality of vias holes on the top build-up layer of a substrate package, the first and the second pluralities of via holes being electrically interconnected;
forming a plurality of through holes adjacent to the second plurality of via holes; and
simultaneously plating the first and the second pluralities of via holes and the plurality of through holes, the plurality of through holes being hermetically-sealed.
2. The method of claim 1 , further comprising simultaneously plating the first and the second pluralities of via holes and the plurality of through holes by way of electrolytic copper plating and periodic reverser pulse plating.
3. The method of claim 2 , further comprising applying a first waveform for plating the first and the second pluralities of via holes and applying a second waveform for plating the plurality of through holes.
4. The method of claim 3 , further comprising plating the plurality of through holes with copper of thickness between 15 and 25 μm.
5. The method of claim 4 , wherein the diameter of the plurality of through holes is between 0.75 and 1.5 mm.