Patent Assignment
Reel/Frame 028812/0671
Assignment of Assignor's Interest
Recorded: 2012-08-17
Pages: 3
Assignors
KIM, TONGSUK
Executed: 2012-07-17
LEE, JANGWOO
Executed: 2012-07-17
LEE, HEESEOK
Executed: 2012-07-17
CHOI, KYOUNGSEI
Executed: 2012-07-07
Assignee
SAMSUNG ELECTRONICS CO., LTD.
129, SAMSUNG-RO, YEONGTONG-GU, SUWON-SI, GYEONGGI-DO, 443-742, KOREA, REPUBLIC OF
Covered Property
(1)
Semiconductor Packages and Methods of Forming the Same