Patent Assignment
Reel/Frame 028845/0964
Assignment of Assignor's Interest
Recorded: 2012-08-24
Pages: 3
Assignors
SASAKI, TAKAFUMI
Executed: 2012-08-06
IMAI, YOSHINORI
Executed: 2012-08-06
KURIBAYASHI, KOEI
Executed: 2012-08-07
NAKASHIMA, SADAO
Executed: 2012-08-08
Assignee
HITACHI KOKUSAI ELECRIC INC.
14-1, SOTOKANDA 4-CHOME, CHIYODA-KU, TOKYO, 101-8980, JAPAN
Covered Property
(1)
Method of Manufacturing Semiconductor Device, Method of Manufacturing Substrate and Substrate Processing Apparatus
Related Assignments
(1)
Other recorded transfers of the patent in this record — the chain of ownership.