Method of manufacturing semiconductor device, method of manufacturing substrate and substrate processing apparatus

1. A method of manufacturing a semiconductor device by using a substrate processing apparatus comprising a reaction chamber configured to process a plurality of substrates stacked at predetermined intervals, a first gas supply nozzle having one or more first gas supply inlets in the reaction chamber and a second gas supply nozzle having one or more second gas supply inlets in the reaction chamber, wherein a first gas flow from the first gas supply inlets and a second gas flow from the second gas supply inlets are crossed with each other before these gas flows reach the substrates, the method comprising:

loading the plurality of substrates into the reaction chamber;

forming a silicon carbide film containing dopant on the substrates, wherein the step of forming a silicon carbide film containing dopant on the substrates is comprised of supplying at least a silicon-containing gas and a chlorine-containing gas, or at least a gas containing silicon atoms and chlorine atoms from the first gas supply inlet into the reaction chamber, supplying at least a carbon-containing gas and a reducing gas from the second gas supply inlet into the reaction chamber and supplying a dopant-containing gas with a source gas containing the atoms for replacement by dopant, into the reaction chamber from either the first gas supply inlet or the second gas supply inlet; and

unloading the substrates from the reaction chamber.

2. A method of manufacturing a semiconductor device of claim 1 , a rare gas is further supplied through the first gas supply inlet.

3. A method of manufacturing a semiconductor device of claim 2 , an argon gas is further supplied through the first gas supply inlet.

4. A method of manufacturing a semiconductor device of claim 1 , the first and second gas supply nozzles have a curved shape according to an inner wall of the heating target object.

5. A method of manufacturing a semiconductor device of claim 4 , the first and second gas supply nozzles have a cylindrical shape.

6. A method of manufacturing a semiconductor device of claim 4 , the first and second gas supply nozzles have a polygonal shape.

7. A method of manufacturing a semiconductor device of claim 4 , the first and second gas supply nozzles have a shape of the arc in a part.

8. A method of manufacturing a semiconductor device of claim 1 , the first gas supply inlet is disposed in a direction toward the second gas supply nozzle, and the second gas supply inlet is disposed in a direction toward the first gas supply nozzle.

9. A method of manufacturing a semiconductor device of claim 8 , the first and second gas supply inlets are disposed at positions facing each other.

10. A method of manufacturing a semiconductor device of claim 8 , the first and second gas supply inlets are disposed at different heights.

11. A method of manufacturing a semiconductor device of claim 8 , the first and second gas supply inlets are spaced the same distance from a wafer in radial directions of the wafer, and the first and second gas supply inlets are disposed at different positions (heights) in a direction perpendicular to the wafer.

12. A method of manufacturing a semiconductor device of claim 1 , the substrate processing apparatus further comprising a magnetic field generating unit installed outside the reaction chamber for electromagnetic induction heating.

13. A method of manufacturing a semiconductor device of claim 1 , the substrate processing apparatus is further comprising an insulator between a reaction tube and a heating target object constituting the reaction chamber.

14. A method of manufacturing a semiconductor device of claim 1 , the substrate processing apparatus is further comprising the first plural divergence nozzles disposed to the first gas supply nozzle and extended to the parallel direction to the surface of the substrate and the second plural divergence nozzles disposed to the second gas supply nozzle and extended to the parallel direction to the surface of the substrate, the first plural divergence nozzles and the second plural divergence nozzles are disposed to the stacked direction of the plural substrates.

15. A method of manufacturing a semiconductor device of claim 1 , supplying the dopant-containing gas into the reaction chamber from the first gas supply inlet, when the dopant is type-p dopant, and supplying the dopant-containing gas into the reaction chamber from the second gas supply inlet, when the dopant is type-n dopant.

16. A method of manufacturing a substrate by using a substrate processing apparatus comprising a reaction chamber configured to process a plurality of substrates stacked at predetermined intervals, a first gas supply nozzle having one or more first gas supply inlets in the reaction chamber and a second gas supply nozzle having one or more second gas supply inlets in the reaction chamber, wherein a first gas flow from the first gas supply inlets and a second gas flow from the second gas supply inlets are crossed with each other before these gas flows reach the substrates, the method comprising:

loading the plurality of substrates into the reaction chamber;

forming a silicon carbide film containing dopant on the substrates, wherein the step of forming a silicon carbide film containing dopant on the substrates is comprised of supplying at least a silicon-containing gas and a chlorine-containing gas, or at least a gas containing silicon atoms and chlorine atoms from the first gas supply inlet into the reaction chamber, supplying at least a carbon-containing gas and a reducing gas from the second gas supply inlet into the reaction chamber and supplying a dopant-containing gas with a source gas containing the atoms for replacement by dopant, into the reaction chamber from either the first gas supply inlet or the second gas supply inlet; and

unloading the substrates from the reaction chamber.