Patent Assignment
Reel/Frame 028852/0670
Assignment of Assignor's Interest
Recorded: 2012-08-27
Pages: 4
Assignor
KELLY, GERALDINE
Executed: 2010-09-30
Assignee
HENKEL LTD.
TECHNOLOGIES HOUSE, WOOD LANE END, HEMEL HEMPSTEAD, HERTFORDSHIRE, HP2 4RQ, UNITED KINGDOM
Covered Property
(1)
Method of Fabricating a Semiconductor Package Using a Fluxing Underfill Composition Applied to Solder Balls in a Dip Process
Related Assignments
(3)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest
Aug 27, 2012
From: CHAN, CHEW B.; CURRIE, MARK; JI, QING; POOLE, NEIL B.
To: HENKEL CORPORATION
Reel/Frame 028852/0753 →
Assignment of Assignor's Interest
Nov 7, 2014
From: HENKEL CORPORATION
To: HENKEL US IP LLC
Reel/Frame 034184/0396 →
Assignment of Assignor's Interest
Feb 26, 2015
From: HENKEL US IP LLC
To: HENKEL IP & HOLDING GMBH
Reel/Frame 035100/0776 →