Patent Assignment
Reel/Frame 028852/0753
Assignment of Assignor's Interest
Recorded: 2012-08-27
Pages: 11
Assignors
CHAN, CHEW B.
Executed: 2010-10-11
CURRIE, MARK
Executed: 2010-10-11
JI, QING
Executed: 2010-09-29
POOLE, NEIL B.
Executed: 2010-10-11
Assignee
HENKEL CORPORATION
ONE HENKEL WAY, ROCKY HILL, CONNECTICUT, 06067
Covered Property
(1)
Method of Fabricating a Semiconductor Package Using a Fluxing Underfill Composition Applied to Solder Balls in a Dip Process
Related Assignments
(3)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest
Aug 27, 2012
From: KELLY, GERALDINE
To: HENKEL LTD.
Reel/Frame 028852/0670 →
Assignment of Assignor's Interest
Nov 7, 2014
From: HENKEL CORPORATION
To: HENKEL US IP LLC
Reel/Frame 034184/0396 →
Assignment of Assignor's Interest
Feb 26, 2015
From: HENKEL US IP LLC
To: HENKEL IP & HOLDING GMBH
Reel/Frame 035100/0776 →