Patent Assignment
Reel/Frame 028889/0607
Assignment of Assignor's Interest
Recorded: 2012-09-01
Pages: 2
Assignor
XUE, YAN XUN
Executed: 2012-08-31
Assignee
ALPHA AND OMEGA SEMICONDUCTOR INCORPORATED
475 OAKMEAD PKWY,, SUNNYVALE, CALIFORNIA, 94085
Covered Property
(1)
Wafer Level Chip Scale Package with Thick Bottom Metal Exposed and Preparation Method Thereof