Patent Assignment
Reel/Frame 028907/0510
Assignment of Assignor's Interest
Recorded: 2012-09-06
Pages: 2
Assignors
IWANO, TOMOHIRO
Executed: 2012-06-15
MINAMI, HISATAKA
Executed: 2012-06-15
AKIMOTO, HIROTAKA
Executed: 2012-06-15
Assignee
HITACHI CHEMICAL COMPANY, LTD.
1-1, NISHI-SHINJUKU 2-CHOME, SHINJUKU-KU, TOKYO, 163-0449, JAPAN
Covered Property
(1)
Method for Producing Abrasive Grains, Method for Producing Slurry, and Method for Producing Polishing Liquid
Related Assignments
(4)
Other recorded transfers of the patent in this record — the chain of ownership.
Change of Address
Mar 4, 2015
From: HITACHI CHEMICAL CO., LTD.
To: HITACHI CHEMICAL COMPANY, LTD.
Reel/Frame 035124/0624 →
Change of Name
Mar 2, 2023
From: HITACHI CHEMICAL COMPANY, LTD.
To: SHOWA DENKO MATERIALS CO., LTD.
Reel/Frame 062917/0865 →
Change of Name
Mar 3, 2023
From: SHOWA DENKO MATERIALS CO., LTD.
To: RESONAC CORPORATION
Reel/Frame 062946/0125 →
Change of Address
Feb 14, 2024
From: RESONAC CORPORATION
To: RESONAC CORPORATION
Reel/Frame 066599/0037 →