IP Library › Assignment 028971/0713
Patent Assignment
Reel/Frame 028971/0713

Assignment of Assignor's Interest

Recorded: 2012-09-17 Pages: 5
Assignors
BALOGLU, BORA
Executed: 2012-09-06
WATSON, JEFFREY R.
Executed: 2012-09-07
Assignee
AMKOR TECHNOLOGY, INC.
1900 SOUTH PRICE ROAD, CHANDLER, ARIZONA, 85286
Covered Property (1)
Molded Electronic Package Geometry to Control Warpage and Die Stress
Patent: 9,269,872 →
Application: 13/614,631 →
Related Assignments (3)
Other recorded transfers of the patent in this record — the chain of ownership.
Patent Security Agreement May 7, 2015
From: AMKOR TECHNOLOGY, INC.
To: BANK OF AMERICA, N.A.
Reel/Frame 035613/0592 →
Security Interest Aug 1, 2018
From: AMKOR TECHNOLOGY, INC.
To: BANK OF AMERICA, N.A., AS AGENT
Reel/Frame 046683/0139 →
Assignment of Assignor's Interest Oct 12, 2020
From: AMKOR TECHNOLOGY, INC.
To: AMKOR TECHNOLOGY SINGAPORE HOLDING PTE.LTD.
Reel/Frame 054046/0673 →