Patent Assignment
Reel/Frame 029014/0132
Assignment of Assignor's Interest
Recorded: 2012-09-24
Pages: 4
Assignee
TOYO TIRE & RUBBER CO., LTD.
17-18, EDOBORI 1-CHOME, NISHI-KU, OSAKA-SHI, OSAKA, 550-8661, JAPAN
Covered Property
(1)
Polishing Pad, Manufacturing Method Therefor, and Method for Manufacturing a Semiconductor Device
Related Assignments
(4)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest
Mar 21, 2016
From: TOYO TIRE & RUBBER CO., LTD.
To: ROHM AND HAAS ELECTRONIC MATERIALS CMP HOLDINGS, INC.
Reel/Frame 038053/0218 →
Change of Name
Oct 29, 2024
From: ROHM & HAAS ELECTRONIC MATERIALS CMP HOLDINGS INC.
To: DUPONT ELECTRONIC MATERIALS HOLDING, INC.
Reel/Frame 069274/0160 →
Security Interest
Nov 3, 2025
From: QNITY ELECTRONICS, INC.
To: JPMORGAN CHASE BANK, N.A., AS COLLATERAL AGENT
Reel/Frame 073515/0243 →
Security Interest
Nov 3, 2025
From: QNITY ELECTRONICS, INC.
To: U.S. BANK TRUST COMPANY, NATIONAL ASSOCIATION, AS NOTES COLLATERAL AGENT
Reel/Frame 073517/0298 →