Patent Assignment
Reel/Frame 029091/0669
Assignment of Assignor's Interest
Recorded: 2012-10-08
Pages: 4
Assignor
KIM, HAN HYOUNG
Executed: 2012-09-18
Assignee
SAMSUNG ELECTRONICS CO., LTD.
129, SAMSUNG-RO, YEONGTONG-GU, SUWON-SI, GYEONGGI-DO, 443-742, KOREA, REPUBLIC OF
Covered Property
(1)
Light Emitting Diode Package and Fabrication Method Thereof