Light emitting diode package and fabrication method thereof
There is provided a light emitting diode (LED) package including: a package main body; an LED chip mounted on the package main body; and a hydrophobic pattern formed on the package main body spaced apart from the LED chip; and a resin unit encapsulating the LED chip and the resin unit is defined by the hydrophobic pattern. The LED package and a fabrication thereof which incur less production costs and have various patterns and enhanced intensity of illumination can be provided.
1. A light emitting diode (LED) package comprising:
a package main body;
an LED chip mounted on the package main body; and
a hydrophobic pattern formed on the package main body spaced apart from the LED chip, wherein the hydrophobic pattern comprises a plurality of nano-structures and a seed layer pattern formed on the package main body,
wherein the plurality of nano-structures are grown from the seed layer pattern, and
the seed layer has a multilayered structure in which gold (Au) and copper (Cu) are alternately stacked; and
a resin encapsulating the LED chip, wherein the resin is defined by the hydrophobic pattern.
2. The LED package of claim 1 , wherein the resin comprises a phosphor.
3. The LED package of claim 1 , wherein the resin has a contact angle of 90° or greater with regard to the package main body.
4. The LED package of claim 1 , wherein the hydrophobic pattern includes a circular shape, a triangular shape, a quadrangular shape, and any combination thereof.
5. The LED package of claim 1 , wherein the hydrophobic pattern comprises at least two spaced apart patterns formed in a same manner.
6. The LED package of claim 1 , further comprising a lens encapsulating the resin, wherein the lens is defined by the hydrophobic pattern.
7. The LED package of claim 5 , wherein the lens has a contact angle of 90° or greater with regard to the package main body.
8. The LED package of claim 1 , wherein the hydrophobic pattern is subjected to an O 2 plasma or an H 2 plasma treatment, or is fluorocarbonated.
9. The LED package of claim 1 , wherein the nano-structures are made of a zinc oxide (ZnO)-based compound.
10. A light emitting diode (LED) package comprising:
a package main body;
an LED chip mounted on the package main body; and
a hydrophilic pattern formed on the package main body spaced apart from the LED chip, wherein the hydrophilic pattern comprises a plurality of nano-structures and a seed layer pattern formed on the package main body,
wherein the seed layer has a multilayered structure in which gold (Au) and copper (Cu) are alternately stacked; and
a resin encapsulating the LED chip, wherein the resin is defined by the hydrophilic pattern.
11. The LED package of claim 10 , wherein the hydrophilic pattern is subjected to an O 2 plasma treatment.