IP Library Assignment 029094/0710
Patent Assignment
Reel/Frame 029094/0710

Assignment of Assignor's Interest

Recorded: 2012-10-09 Pages: 2
Assignors
HIRAIWA, DAISUKE
Executed: 2012-08-23
OKABE, TAKEHIKO
Executed: 2012-08-23
Assignee
SHOWA DENKO K.K.
13-9, SHIBA DAIMON 1-CHOME, MINATO-KU, TOKYO, 1058518, JAPAN
Covered Property (1)
Semiconductor Light Emitting Chip and Method for Processing Substrate
Patent: 8,836,086 →
Application: 13/639,608 →
Publication: US 2013/0037825
Related Assignments (1)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest Dec 4, 2012
From: SHOWA DENKO K.K.
To: TOYODA GOSEI CO., LTD.
Reel/Frame 029401/0974 →