Patent Assignment
Reel/Frame 029095/0168
Assignment of Assignor's Interest
Recorded: 2012-10-09
Pages: 2
Assignors
KIKUCHI, KATSUMI
Executed: 2012-09-26
YAMAMICHI, SHINTARO
Executed: 2012-09-26
MURAI, HIDEYA
Executed: 2012-09-26
MORI, KENTARO
Executed: 2012-09-26
NAKASHIMA, YOSHIKI
Executed: 2012-09-26
Assignee
NEC CORPORATION
7-1, SHIBA 5-CHOME, MINATO-KU, TOKYO, 108-8001, JAPAN
Covered Property
(1)
Semiconductor Element-Embedded Wiring Substrate