Patent Assignment
Reel/Frame 029134/0807
Assignment of Assignor's Interest
Recorded: 2012-10-16
Pages: 2
Assignors
ONO, HIROSHI
Executed: 2012-09-08
SHINODA, TAKASHI
Executed: 2012-09-08
OKADA, YUUHEI
Executed: 2012-09-11
Assignee
HITACHI CHEMICAL COMPANY, LTD.
1-1, NISHI-SHINJUKU 2-CHOME, SHINJUKU-KU, TOKYO, 163-0449, JAPAN
Covered Property
(1)
Polishing Solution for Copper Polishing, and Polishing Method Using Same
Related Assignments
(4)
Other recorded transfers of the patent in this record — the chain of ownership.
Change of Address
Sep 30, 2014
From: HITACHI CHEMICAL COMPANY, LTD.
To: HITACHI CHEMICAL COMPANY, LTD.
Reel/Frame 033860/0072 →
Change of Name
Mar 2, 2023
From: HITACHI CHEMICAL COMPANY, LTD.
To: SHOWA DENKO MATERIALS CO., LTD.
Reel/Frame 062917/0865 →
Change of Name
Mar 3, 2023
From: SHOWA DENKO MATERIALS CO., LTD.
To: RESONAC CORPORATION
Reel/Frame 062946/0125 →
Change of Address
Feb 14, 2024
From: RESONAC CORPORATION
To: RESONAC CORPORATION
Reel/Frame 066599/0037 →