Patent Assignment
Reel/Frame 033860/0072
Change of Address
Recorded: 2014-09-30
Pages: 29
Assignor
HITACHI CHEMICAL COMPANY, LTD.
Executed: 2013-01-09
Assignee
HITACHI CHEMICAL COMPANY, LTD.
9-2, MARUNOUCHI 1 CHOME, CHIYODA-KU, 100-6606, JAPAN
Covered Property
(1)
Polishing Solution for Copper Polishing, and Polishing Method Using Same
Related Assignments
(4)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest
Oct 16, 2012
From: ONO, HIROSHI; SHINODA, TAKASHI; OKADA, YUUHEI
To: HITACHI CHEMICAL COMPANY, LTD.
Reel/Frame 029134/0807 →
Change of Name
Mar 2, 2023
From: HITACHI CHEMICAL COMPANY, LTD.
To: SHOWA DENKO MATERIALS CO., LTD.
Reel/Frame 062917/0865 →
Change of Name
Mar 3, 2023
From: SHOWA DENKO MATERIALS CO., LTD.
To: RESONAC CORPORATION
Reel/Frame 062946/0125 →
Change of Address
Feb 14, 2024
From: RESONAC CORPORATION
To: RESONAC CORPORATION
Reel/Frame 066599/0037 →