IP Library › Assignment 029179/0103
Patent Assignment
Reel/Frame 029179/0103

Assignment of Assignor's Interest

Recorded: 2012-10-24 Pages: 2
Assignors
LEE, SANG-MIN
Executed: 2012-10-15
KWON, SOON-CHUL
Executed: 2012-10-15
Assignee
SAMSUNG TECHWIN CO., LTD.
28 SUNGJU-DONG, KYONGSANGNAM-DO, CHANGWON-CITY, KOREA, REPUBLIC OF
Covered Property (1)
Method of Manufacturing Multi-Layer Circuit Board and Multi-Layer Circuit Board Manufactured by Using the Method
Patent: 9,532,466 →
Application: 13/658,870 →
Publication: US 2013/0161073
Related Assignments (2)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest Jul 16, 2014
From: SAMSUNG TECHWIN CO., LTD.
To: MDS CO. LTD.
Reel/Frame 033327/0442 →
Change of Name Apr 21, 2015
From: MDS CO. LTD.
To: HAESUNG DS CO., LTD.
Reel/Frame 035475/0415 →