Patent Assignment
Reel/Frame 029195/0661
Assignment of Assignor's Interest
Recorded: 2012-10-26
Pages: 2
Assignors
SHIMADA, KAZUTO
Executed: 2012-08-10
IKEDA, KIMI
Executed: 2012-08-14
YABUKI, YOSHIHARU
Executed: 2012-08-15
ARIOKA, DAISUKE
Executed: 2012-08-16
Assignee
FUJIFILM CORPORATION
26-30, NISHIAZABU 2-CHOME, MINATO-KU, TOKYO, JAPAN
Covered Property
(1)
Polymerizable Composition for Solder Resist, and Solder Resist Pattern Formation Method