Patent Assignment
Reel/Frame 029226/0245
Assignment of Assignor's Interest
Recorded: 2012-11-01
Pages: 4
Assignee
MITSUBISHI MATERIALS CORPORATION
3-2, OTEMACHI 1-CHOME, CHIYODA-KU, TOKYO, 100-8117, JAPAN
Covered Property
(1)
Copper Alloy for Electronic Device, Method for Producing Copper Alloy for Electronic Device, and Copper Alloy Rolled Material for Electronic Device