Patent Assignment
Reel/Frame 029365/0608
Assignment of Assignor's Interest
Recorded: 2012-11-28
Pages: 4
Assignors
DANG, BING
Executed: 2012-11-28
KNICKERBOCKER, JOHN U.
Executed: 2012-11-28
TSANG, CORNELIA KANG-I
Executed: 2012-11-28
Assignee
INTERNATIONAL BUSINESS MACHINES CORPORATION
NEW ORCHARD ROAD, ARMONK, NEW YORK, 10504
Covered Property
(1)
Wafer Debonding Using Long-Wavelength Infrared Radiation Ablation
Application:
13/687,531 →
Publication:
US 2014/0144593
Related Assignments
(2)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest
Sep 3, 2015
From: INTERNATIONAL BUSINESS MACHINES CORPORATION
To: GLOBALFOUNDRIES U.S. 2 LLC
Reel/Frame 036550/0001 →
Assignment of Assignor's Interest
Oct 5, 2015
From: GLOBALFOUNDRIES U.S. 2 LLC; GLOBALFOUNDRIES U.S. INC.
To: GLOBALFOUNDRIES INC.
Reel/Frame 036779/0001 →