Patent Assignment
Reel/Frame 029393/0590
Assignment of Assignor's Interest
Recorded: 2012-12-03
Pages: 6
Assignors
KIM, JAE CHOON
Executed: 2012-11-26
KIM, JICHUL
Executed: 2012-11-26
BAE, JIN-KWON
Executed: 2012-11-26
CHO, EUNSEOK
Executed: 2012-11-26
Assignee
SAMSUNG ELECTRONICS CO., LTD.
129, SAMSUNG-RO, YEONGTONG-GU, GYEONGGI-DO, SUWON-SI, 443-742, KOREA, REPUBLIC OF
Covered Property
(1)
Thermoelectric Cooling Packages and Thermal Management Methods Thereof