Thermoelectric cooling packages and thermal management methods thereof
Provided are thermoelectric cooling packages and thermal management methods thereof. The method may include measuring a temperature of the thermoelectric cooling package including a semiconductor chip and a thermoelectric cooler, comparing the temperature of the thermoelectric cooling package with a target temperature, operating the thermoelectric cooler when the temperature of the thermoelectric cooling package is higher than the target temperature, and stopping the operation of the thermoelectric cooler when the temperature of the thermoelectric cooling package becomes lower than the target temperature.
1. A device comprising:
a first board comprising a first area and a second area not overlapping the first area;
a thermoelectric semiconductor disposed at the first area of the first board configured to supply a voltage to the thermoelectric semiconductor;
a package disposed at the second area of the first board; and
a second board,
wherein the thermoelectric semiconductor is disposed between the first board and the second board,
a heat gradient is generated in the thermoelectric semiconductor when the voltage is supplied to the thermoelectric semiconductor, and
the first area and the second area are separated by a gap formed in the first board.
2. The device of claim 1 , further comprising a heat sink disposed adjacent to the second board.
3. The device of claim 1 further comprising a controller which controls a supply of the voltage to the thermoelectric semiconductor so that the voltage is supplied if a temperature of the package is above a target temperature and the voltage is not supplied if the temperature is below the target temperature.
4. The device of claim 1 further comprising a temperature sensor which detects a temperature of the package and a voltage is supplied to the thermoelectric semiconductor based on the detected temperature.
5. A handheld mobile apparatus comprising the device of claim 1 and further comprising:
a display panel,
wherein the display panel is disposed adjacent to the device.
6. The handheld mobile device of claim 5 further comprising:
a lower casing disposed below the device,
wherein the display panel is displayed above the device, and
wherein the thermoelectric semiconductor operates to transfer heat from the display panel and heat from the package to the lower casing.
7. The handheld mobile device of claim 5 , further comprising temperature sensor disposed inside or on the display panel.
8. The handheld mobile device of claim 5 , wherein the display panel is one from among a liquid crystal display panel and an organic light-emitting diode (OLED) display.
9. The handheld mobile device of claim 8 , wherein the OLED display is an active-matrix OLED display.
10. The handheld mobile device of claim 5 , wherein the thermoelectric semiconductor is repetitively turned on and off.
11. The device of claim 1 , wherein the first board comprises vias which are formed in the first board through the first area and supply the voltage to the thermoelectric semiconductor.
12. The device of claim 1 , wherein the thermoelectric semiconductor comprises at least two elements, and the device further comprises:
a controller configured to control a supply of the voltage to the thermoelectric semiconductor and control a change in a heat transfer direction in the thermoelectric semiconductor in response to changing a polarity of the voltage supplied to each of the at least two elements.
13. A device comprising:
a first board comprising a first area and a second area not overlapping the first area;
a thermoelectric semiconductor disposed at the first area of the first board configured to supply a voltage to the thermoelectric semiconductor;
a package disposed at the second area of the first board; and
a second board,
wherein the thermoelectric semiconductor is disposed between the first board and the second board,
a heat gradient is generated in the thermoelectric semiconductor when the voltage is supplied to the thermoelectric semiconductor,
the heat is transferred substantially along an open loop path from a first portion of a lower half of the device including the package, to an upper half of the device, and from the upper half of the device to a second portion of the lower half of the device that is not overlapping with the first portion,
the lower half of the device is disposed proximate the first board, and
the upper half of the device is disposed proximate the second board.